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PAN B511-1X from Panasonic in three versions: Next Gen-module for innovative Bluetooth 6 applications – at Rutronik

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SAVE THE DATE 11 Mar 2025
Embedded World 2025

New at Rutronik

TELIT DVT3990252494

DVT3990252494

Wireless Technologies
  • FE910C04-WW Global Variant DVT
  • package: MODULE
  • Packaging: INDIVIDUAL
New Product
BOSCH SE 0273.017.046-1NV

0273.017.046-1NV

Semiconductors
  • 3-Axis 16bit MEMS Sensor
  • package: WLCSP
  • Packaging: REEL
New Product
BOSCH SE 0273.017.042-1NV

0273.017.042-1NV

Semiconductors
  • 3-Axis 16bit MEMS sensor
  • package: WLCSP
  • Packaging: REEL
New Product
MEDIATEK GENIO_510_EVK

GENIO_510_EVK

Semiconductors
  • Genio 510 Development Kit
  • package: HardWare
  • Packaging: BOX
New Product
EEMB CR2032-5pcs/blister-EEMB

CR2032-5pcs/blister-EEMB

Electromechanical Components
  • LITH 3V 210MAH BLISTER
  • package: BLISTER
  • Packaging: BOX
NORDIC NRF9161-LACA-R7

NRF9161-LACA-R7

Wireless Technologies
  • DECT NR+/LTE-M/NB-IoT/GNSS SIP
  • package: SIP
  • Packaging: REEL
Topseller
NORDIC NRF9161-DK

NRF9161-DK

Wireless Technologies
  • LTE-M, NB-IoT, GNSS, DECT...
  • Packaging: INDIVIDUAL
AMS OSRAM Q65112A6964

Q65112A6964

Semiconductors
  • POWER-TOPLED YELLOW 593NM...
  • package: PLCC-4
  • Packaging: REEL

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