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Optimized for semiconductor test technology: High-speed photo relays from Toshiba at Rutronik

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SAVE THE DATE 08 Oct 2025
Engineering Design Show See all Events

New at Rutronik

BOSCH SE 0273.017.046-1NV

0273.017.046-1NV

Semiconductors
  • 3-Axis 16bit MEMS Sensor
  • package: WLCSP
  • Packaging: REEL
BOSCH SE 0273.017.042-1NV

0273.017.042-1NV

Semiconductors
  • 3-Axis 16bit MEMS sensor
  • package: WLCSP
  • Packaging: REEL
MEDIATEK GENIO_510_EVK

GENIO_510_EVK

Semiconductors
  • Genio 510 Development Kit
  • package: HardWare
  • Packaging: BOX
EEMB CR2032-5pcs/blister-EEMB

CR2032-5pcs/blister-EEMB

Electromechanical Components
  • LITH 3V 210MAH BLISTER
  • package: BLISTER
  • Packaging: BOX
NORDIC NRF9161-LACA-R7

NRF9161-LACA-R7

Wireless Technologies
  • DECT NR+/LTE-M/NB-IoT/GNSS SIP
  • package: SIP
  • Packaging: REEL
Topseller
NORDIC NRF9161-DK

NRF9161-DK

Wireless Technologies
  • LTE-M, NB-IoT, GNSS, DECT...
  • Packaging: INDIVIDUAL
DISPLAYTEC 64128M-FC-BW-RGB

64128M-FC-BW-RGB

Displays & Monitors
  • LCD pass M 64128M-FC-BW-RGB
  • Packaging: INDIVIDUAL
Best Choice
INFINEON IPD90N04S403ATMA1

IPD90N04S403ATMA1

Semiconductors
  • MOSFET 40V 3.2mOHM AECQ TO252
  • package: DPAK
  • Packaging: REEL

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