GD25F256FBIRY
GIGADEVICE
GD25F256FBIRY
Description:
SPI NOR 256Mbit 3,3V FBGA24 I-Temp
Supplier:
GigaDevice Semiconductor
Matchcode:
GD25F256FBIRY
Rutronik No.:
ICPROM11399
Unit Pack:
4800
MOQ:
4800
package:
TFBGA24
Packaging:
TRAY
- Density
- 256M bit
- Organisation
- 8Mx8
- U(cc)
- 3.3 V
- Package
- TFBGA24
- Permis.T(A) min
- -40 °C
- Permis.T(A) max
- 85 °C
- Automotive
- NO
- RoHS Status
- RoHS-conform
- Packaging
- TRAY
- Type
- SPI NOR
- ECCN
- 3A991
- Country
- China
- Supplier Lead time
- 26 weeks