GD25LX256EBARR
GIGADEVICE
GD25LX256EBARR
Description:
SPI NOR 256Mbit 1.8V TFBGA24 Automotvie
Supplier:
GigaDevice Semiconductor
Matchcode:
GD25LX256EBARR
Rutronik No.:
ICPROM11379
Unit Pack:
3000
MOQ:
3000
package:
TFBGA24
Packaging:
REEL
- Density
- 256M bit
- U(cc)
- 1.8 V
- Package
- TFBGA24
- Permis.T(A) min
- -40 °C
- Permis.T(A) max
- 125 °C
- Automotive
- AEC-Q(100)
- RoHS Status
- RoHS-conform
- Packaging
- REEL
- Type
- SPI NOR
- ECCN
- 3A991
- Customs Tariff No.
- 85423261000
- Country
- China
- Supplier Lead time
- 26 weeks