The 8 pin wafer level chip scale package (WL-CSP) is an additional package variant to the existing product MB85RS1MT. In comparison to the industry standard SOP-8 package, the new WL-CSP package, which measures 3.09x2.28x0.33mm, reduces the surface mounting area by 77%, and the device height by 80%. With this product release, Fujitsu is offering 1Mbit SPI FRAM product with the industry’s smallest packaging technology.

The WL-CSP package makes FRAM the ideal non-volatile memory solution for wearable and sensor applications. These fast expanding markets request ultra small device dimensions, extremely low power consumption for maximum battery lifetime, and high endurance in write cycles in case of real time logging. Exactly in these aspects, FRAM is delivering an excellent performance.