EF31-7422-1122-I0_50/DA01-00038A
EF31-7422-1122-I0_50/DA01-00038A
Description:
COMe Module 3.1 T6 Compact Qualcomm
Supplier:
SECO
Matchcode:
EF31-7422-1122-I0_50/DA01-0003
Rutronik No.:
DISBOA4037
Unit Pack:
1
MOQ:
1
Packaging:
BOX
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- Form factor
- COME COMPA
- COMe type
- TYPE 6
- System chipset
- V2000
- Socket type
- ONBOARD
- Chipset manufac
- AMD
- Chipset techno.
- X86
- Memory type
- LPDDR4
- Memory sockets
- ONBOARD
- Max.memory size
- 64 GB
- Onboard flash
- NONE
- LVDS onbord
- Y Y/N
- SSD connector
- NONE
- CAN bus
- N Y/N
- I²C
- Y Y/N
- Operating temp.
- 0 TO +60°C
- Installed CPU
- V2748
- Installed DRAM
- 0 GB
- Installed Flash
- 0 GB
- Installed OS
- NONE
- Integrated WiFi
- N Y/N
- Integrated BT
- N Y/N
- Integr.cellular
- N Y/N
- Automotive
- NO
- RoHS Status
- RoHS-conform
- Packaging
- BOX
- ECCN
- 5A992
- Customs Tariff No.
- 84733020000
- Country
- Italy
- Supplier Lead time
- 6 weeks
